Vulnerabilities > Qualcomm > Wcd9380 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-03-10 | CVE-2022-33254 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem while processing SIB1 Message. | 7.5 |
2023-03-10 | CVE-2022-33256 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in Multi-mode call processor. | 9.8 |
2023-03-10 | CVE-2022-33257 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone. | 7.0 |
2023-03-10 | CVE-2022-33260 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to stack based buffer overflow in core while sending command from USB of large size. | 7.8 |
2023-03-10 | CVE-2022-33272 | Reachable Assertion vulnerability in Qualcomm products Transient DOS in modem due to reachable assertion. | 7.5 |
2023-03-10 | CVE-2022-33278 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity. | 7.8 |
2023-03-10 | CVE-2022-33309 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS due to buffer over-read in WLAN Firmware while parsing secure FTMR frame with size lesser than 39 Bytes. | 7.5 |
2023-03-10 | CVE-2022-40515 | Double Free vulnerability in Qualcomm products Memory corruption in Video due to double free while playing 3gp clip with invalid metadata atoms. | 9.8 |
2023-03-10 | CVE-2022-40527 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in WLAN while processing PEER ID populated by TQM. | 7.5 |
2023-03-10 | CVE-2022-40530 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in WLAN due to integer overflow to buffer overflow in WLAN during initialization phase. | 7.8 |