Vulnerabilities > Qualcomm > Wcd9375 Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-02-12 | CVE-2022-40502 | Improper Input Validation vulnerability in Qualcomm products Transient DOS due to improper input validation in WLAN Host. | 7.5 |
2023-02-12 | CVE-2022-40512 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware due to buffer over-read while processing probe response or beacon. | 7.5 |
2023-01-09 | CVE-2022-22088 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Bluetooth HOST due to buffer overflow while parsing the command response received from remote | 8.8 |
2023-01-09 | CVE-2022-25746 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in kernel due to missing checks when updating the access rights of a memextent mapping. | 7.8 |
2023-01-09 | CVE-2022-33276 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking size of input in modem while receiving WMI_REQUEST_STATS_CMDID command. | 7.8 |
2023-01-09 | CVE-2022-40516 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Core due to stack-based buffer overflow. | 7.8 |
2023-01-09 | CVE-2022-40517 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in core due to stack-based buffer overflow | 7.8 |
2023-01-09 | CVE-2022-40520 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to stack-based buffer overflow in Core | 7.8 |
2022-12-13 | CVE-2022-25672 | Reachable Assertion vulnerability in Qualcomm products Denial of service in MODEM due to reachable assertion while processing SIB1 with invalid Bandwidth in Snapdragon Mobile | 7.5 |
2022-12-13 | CVE-2022-25677 | Use After Free vulnerability in Qualcomm products Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |