Vulnerabilities > Qualcomm > Wcd9370 Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-03-17 | CVE-2020-11221 | Information Exposure vulnerability in Qualcomm products Usage of syscall by non-secure entity can allow extraction of secure QTEE diagnostic information in clear text form due to insufficient checks in the syscall handler and leads to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2021-03-17 | CVE-2020-11220 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products While processing storage SCM commands there is a time of check or time of use window where a pointer used could be invalid at a specific time while executing the storage SCM call in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 6.4 |
| 2021-03-17 | CVE-2020-11199 | Information Exposure vulnerability in Qualcomm products HLOS to access EL3 stack canary by just mapping imem region due to Improper access control and can lead to information exposure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2021-02-22 | CVE-2020-3664 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read access in hypervisor due to an invalid read access attempt by passing invalid addresses in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 6.0 |
| 2021-02-22 | CVE-2020-11198 | Improper Cross-boundary Removal of Sensitive Data vulnerability in Qualcomm products Key material used for TZ diag buffer encryption and other data related to log buffer is not wiped securely due to improper usage of memset in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 6.7 |
| 2021-02-22 | CVE-2020-11147 | Use After Free vulnerability in Qualcomm products Use after free issue in audio modules while removing and freeing objects during list iteration due to incorrect usage of macro in Snapdragon Compute, Snapdragon Industrial IOT, Snapdragon Mobile | 6.7 |