Vulnerabilities > Qualcomm > Wcd9370 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-09-16 | CVE-2022-22066 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption occurs while processing command received from HLOS due to improper length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-09-16 | CVE-2022-22074 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory Corruption during wma file playback due to integer overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-09-16 | CVE-2022-22081 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in audio module due to integer overflow in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2022-09-16 | CVE-2022-22089 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in audio while playing record due to improper list handling in two threads in Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2022-09-16 | CVE-2022-22091 | Unspecified vulnerability in Qualcomm products Improper authorization of a replayed LTE security mode command can lead to a denial of service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.5 |
| 2022-09-16 | CVE-2022-22092 | Use After Free vulnerability in Qualcomm products Memory corruption in kernel due to use after free issue in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2022-09-16 | CVE-2022-22093 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption or temporary denial of service due to improper handling of concurrent hypervisor operations to attach or detach IRQs from virtual interrupt sources in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.0 |
| 2022-09-16 | CVE-2022-22094 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products memory corruption in Kernel due to race condition while getting mapping reference in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.0 |
| 2022-09-16 | CVE-2022-22095 | Use After Free vulnerability in Qualcomm products Memory corruption in synx driver due to use-after-free condition in the synx driver due to accessing object handles without acquiring lock in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2022-09-16 | CVE-2022-25656 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow and memory corruption due to improper validation of buffer size sent to write to console when computing the payload size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |