Vulnerabilities > Qualcomm > Wcd9370 Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-10-03 | CVE-2023-33027 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing rsn ies. | 7.5 |
2023-10-03 | CVE-2023-33029 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Service during a remote call from HLOS to DSP. | 7.8 |
2023-10-03 | CVE-2023-33034 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while parsing the ADSP response command. | 7.8 |
2023-10-03 | CVE-2023-33035 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while invoking callback function of AFE from ADSP. | 7.8 |
2023-09-05 | CVE-2022-33275 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in WLAN HAL when received lm_itemNum is out of range. | 7.8 |
2023-09-05 | CVE-2023-21636 | Improper Validation of Array Index vulnerability in Qualcomm products Memory Corruption due to improper validation of array index in Linux while updating adn record. | 7.8 |
2023-09-05 | CVE-2023-21644 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in RIL due to Integer Overflow while triggering qcril_uim_request_apdu request. | 7.8 |
2023-09-05 | CVE-2023-21646 | Reachable Assertion vulnerability in Qualcomm products Transient DOS in Modem while processing invalid System Information Block 1. | 7.5 |
2023-09-05 | CVE-2023-21654 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio during playback session with audio effects enabled. | 7.8 |
2023-09-05 | CVE-2023-21662 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core Platform while printing the response buffer in log. | 7.8 |