Vulnerabilities > Qualcomm > Wcd9370 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-06-14 | CVE-2021-35130 | Use After Free vulnerability in Qualcomm products Memory corruption in graphics support layer due to use after free condition in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.2 |
| 2022-06-14 | CVE-2022-22057 | Race Condition vulnerability in Qualcomm products Use after free in graphics fence due to a race condition while closing fence file descriptor and destroy graphics timeline simultaneously in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2022-22064 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over read due to lack of size validation while unpacking frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2022-22065 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read in WLAN HOST due to improper length check can lead to DOS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2022-22068 | Use After Free vulnerability in Qualcomm products kernel event may contain unexpected content which is not generated by NPU software in asynchronous execution mode in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
| 2022-06-14 | CVE-2022-22071 | Use After Free vulnerability in Qualcomm products Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.2 |
| 2022-06-14 | CVE-2022-22082 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to possible buffer overflow while parsing DSF header with corrupted channel count in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
| 2022-06-14 | CVE-2022-22083 | Out-of-bounds Read vulnerability in Qualcomm products Denial of service due to memory corruption while extracting ape header from clips in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2022-22084 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when extracting qcp audio file due to lack of check on data length in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
| 2022-06-14 | CVE-2022-22085 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in video due to buffer overflow while reading the dts file in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |