Vulnerabilities > Qualcomm > Wcd9360 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-12-05 | CVE-2023-33044 | Reachable Assertion vulnerability in Qualcomm products Transient DOS in Data modem while handling TLB control messages from the Network. | 7.5 |
| 2023-12-05 | CVE-2023-33063 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Services during a remote call from HLOS to DSP. | 7.8 |
| 2023-12-05 | CVE-2023-33080 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. | 7.5 |
| 2023-12-05 | CVE-2023-33088 | NULL Pointer Dereference vulnerability in Qualcomm products Memory corruption when processing cmd parameters while parsing vdev. | 7.8 |
| 2023-12-05 | CVE-2023-33089 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS when processing a NULL buffer while parsing WLAN vdev. | 7.5 |
| 2023-12-05 | CVE-2023-33098 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing WPA IES, when it is passed with length more than expected size. | 7.5 |
| 2023-11-07 | CVE-2023-24852 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Core due to secure memory access by user while loading modem image. | 7.8 |
| 2023-11-07 | CVE-2023-28545 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in TZ Secure OS while loading an app ELF. | 7.8 |
| 2023-11-07 | CVE-2023-28556 | Unspecified vulnerability in Qualcomm products Cryptographic issue in HLOS during key management. | 7.8 |
| 2023-11-07 | CVE-2023-33031 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer. | 7.8 |