Vulnerabilities > Qualcomm > Wcd9341 Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-03-10 | CVE-2022-25705 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in modem due to integer overflow to buffer overflow while handling APDU response | 7.8 |
2023-03-10 | CVE-2022-25709 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in modem due to use of out of range pointer offset while processing qmi msg | 7.8 |
2023-03-10 | CVE-2022-33213 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in modem due to buffer overflow while processing a PPP packet | 8.8 |
2023-03-10 | CVE-2022-33242 | Improper Authentication vulnerability in Qualcomm products Memory corruption due to improper authentication in Qualcomm IPC while loading unsigned lib in audio PD. | 7.8 |
2023-03-10 | CVE-2022-33245 | Use After Free vulnerability in Qualcomm products Memory corruption in WLAN due to use after free | 7.8 |
2023-03-10 | CVE-2022-33250 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in modem when network repeatedly sent invalid message container for NR to LTE handover. | 7.5 |
2023-03-10 | CVE-2022-33254 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem while processing SIB1 Message. | 7.5 |
2023-03-10 | CVE-2022-33257 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone. | 7.0 |
2023-03-10 | CVE-2022-33260 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to stack based buffer overflow in core while sending command from USB of large size. | 7.8 |
2023-03-10 | CVE-2022-33272 | Reachable Assertion vulnerability in Qualcomm products Transient DOS in modem due to reachable assertion. | 7.5 |