Vulnerabilities > Qualcomm > Wcd9335 Firmware

DATE CVE VULNERABILITY TITLE RISK
2025-03-03 CVE-2024-53023 Use After Free vulnerability in Qualcomm products
Memory corruption may occur while accessing a variable during extended back to back tests.
local
low complexity
qualcomm CWE-416
7.8
2025-03-03 CVE-2024-53024 NULL Pointer Dereference vulnerability in Qualcomm products
Memory corruption in display driver while detaching a device.
local
low complexity
qualcomm CWE-476
7.8
2025-03-03 CVE-2024-53027 Classic Buffer Overflow vulnerability in Qualcomm products
Transient DOS may occur while processing the country IE.
network
low complexity
qualcomm CWE-120
7.5
2025-03-03 CVE-2025-21424 Use After Free vulnerability in Qualcomm products
Memory corruption while calling the NPU driver APIs concurrently.
local
low complexity
qualcomm CWE-416
7.8
2025-02-03 CVE-2024-45584 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Memory corruption can occur when a compat IOCTL call is followed by a normal IOCTL call from userspace.
local
low complexity
qualcomm CWE-119
7.8
2025-02-03 CVE-2024-49834 Improper Validation of Array Index vulnerability in Qualcomm products
Memory corruption while power-up or power-down sequence of the camera sensor.
local
low complexity
qualcomm CWE-129
7.8
2025-02-03 CVE-2024-49838 Out-of-bounds Read vulnerability in Qualcomm products
Information disclosure while parsing the OCI IE with invalid length.
network
low complexity
qualcomm CWE-125
7.5
2025-01-06 CVE-2024-33067 Out-of-bounds Read vulnerability in Qualcomm products
Information disclosure while invoking callback function of sound model driver from ADSP for every valid opcode received from sound model driver.
local
low complexity
qualcomm CWE-125
5.5
2024-12-02 CVE-2024-33056 Out-of-bounds Read vulnerability in Qualcomm products
Memory corruption when allocating and accessing an entry in an SMEM partition continuously.
local
low complexity
qualcomm CWE-125
7.8
2024-12-02 CVE-2024-33063 Integer Overflow or Wraparound vulnerability in Qualcomm products
Transient DOS while parsing the ML IE when a beacon with common info length of the ML IE greater than the ML IE inside which this element is present.
network
low complexity
qualcomm CWE-190
7.5