Vulnerabilities > Qualcomm > Wcd9306 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-06-09 | CVE-2020-11233 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Time-of-check time-of-use race condition While processing partition entries due to newly created buffer was read again from mmc without validation in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.9 |
| 2021-06-09 | CVE-2020-11239 | Use After Free vulnerability in Qualcomm products Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
| 2021-05-07 | CVE-2020-11279 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 10.0 |
| 2021-05-07 | CVE-2020-11285 | Out-of-bounds Read vulnerability in Qualcomm products Buffer over-read while unpacking the RTCP packet we may read extra byte if wrong length is provided in RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.4 |
| 2021-05-07 | CVE-2020-11288 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Out of bound write can occur in playready while processing command due to lack of input validation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.2 |
| 2021-05-07 | CVE-2020-11289 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Out of bound write can occur in TZ command handler due to lack of validation of command ID in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.2 |
| 2021-05-07 | CVE-2020-11293 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read can happen in Widevine TA while copying data to buffer from user data due to lack of check of buffer length received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 3.6 |
| 2021-04-07 | CVE-2020-11255 | Memory Leak vulnerability in Qualcomm products Denial of service while processing RTCP packets containing multiple SDES reports due to memory for last SDES packet is freed and rest of the memory is leaked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2021-04-07 | CVE-2020-11252 | Out-of-bounds Read vulnerability in Qualcomm products Trustzone initialization code will disable xPU`s when memory dumps are enabled and lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 4.7 |
| 2021-04-07 | CVE-2020-11251 | Out-of-bounds Read vulnerability in Qualcomm products Out-of-bounds read vulnerability while accessing DTMF payload due to lack of check of buffer length before copying in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.4 |