Vulnerabilities > Qualcomm > Video Collaboration VC3 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2025-02-03 | CVE-2024-38411 | Use After Free vulnerability in Qualcomm products Memory corruption while registering a buffer from user-space to kernel-space using IOCTL calls. | 7.8 |
| 2025-02-03 | CVE-2024-49839 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption during management frame processing due to mismatch in T2LM info element. | 9.8 |
| 2025-01-06 | CVE-2024-33041 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when input parameter validation for number of fences is missing for fence frame IOCTL calls, | 7.8 |
| 2025-01-06 | CVE-2024-33055 | Use After Free vulnerability in Qualcomm products Memory corruption while invoking IOCTL calls to unmap the DMA buffers. | 7.8 |
| 2025-01-06 | CVE-2024-33067 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while invoking callback function of sound model driver from ADSP for every valid opcode received from sound model driver. | 5.5 |
| 2025-01-06 | CVE-2024-45541 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption when IOCTL call is invoked from user-space to read board data. | 7.8 |
| 2025-01-06 | CVE-2024-45542 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when IOCTL call is invoked from user-space to write board data to WLAN driver. | 7.8 |
| 2025-01-06 | CVE-2024-45558 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS can occur when the driver parses the per STA profile IE and tries to access the EXTN element ID without checking the IE length. | 7.5 |
| 2024-10-07 | CVE-2024-43047 | Use After Free vulnerability in Qualcomm products Memory corruption while maintaining memory maps of HLOS memory. | 7.8 |
| 2024-09-02 | CVE-2024-33038 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while passing untrusted/corrupted pointers from DSP to EVA. | 7.8 |