Vulnerabilities > Qualcomm > Sxr2230P Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2025-01-06 | CVE-2024-45558 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS can occur when the driver parses the per STA profile IE and tries to access the EXTN element ID without checking the IE length. | 7.5 |
| 2024-12-02 | CVE-2024-33056 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption when allocating and accessing an entry in an SMEM partition continuously. | 7.8 |
| 2024-12-02 | CVE-2024-33063 | Integer Overflow or Wraparound vulnerability in Qualcomm products Transient DOS while parsing the ML IE when a beacon with common info length of the ML IE greater than the ML IE inside which this element is present. | 7.5 |
| 2024-11-04 | CVE-2024-23377 | Unspecified vulnerability in Qualcomm products Memory corruption while invoking IOCTL command from user-space, when a user modifies the original packet size of the command after system properties have been already sent to the EVA driver. | 6.7 |
| 2024-11-04 | CVE-2024-33068 | Use After Free vulnerability in Qualcomm products Transient DOS while parsing fragments of MBSSID IE from beacon frame. | 6.5 |
| 2024-11-04 | CVE-2024-38403 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing BTM ML IE when per STA profile is not included. | 6.5 |
| 2024-11-04 | CVE-2024-38405 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing the CU information from RNR IE. | 6.5 |
| 2024-11-04 | CVE-2024-38408 | Unspecified vulnerability in Qualcomm products Cryptographic issue when a controller receives an LMP start encryption command under unexpected conditions. | 9.1 |
| 2024-11-04 | CVE-2024-38415 | Use After Free vulnerability in Qualcomm products Memory corruption while handling session errors from firmware. | 7.8 |
| 2024-11-04 | CVE-2024-38424 | Use After Free vulnerability in Qualcomm products Memory corruption during GNSS HAL process initialization. | 7.8 |