Vulnerabilities > Qualcomm > Sw5100P Firmware

DATE CVE VULNERABILITY TITLE RISK
2024-01-02 CVE-2023-33112 Unspecified vulnerability in Qualcomm products
Transient DOS when WLAN firmware receives "reassoc response" frame including RIC_DATA element.
network
low complexity
qualcomm
7.5
2024-01-02 CVE-2023-33113 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption when resource manager sends the host kernel a reply message with multiple fragments.
local
low complexity
qualcomm CWE-787
7.8
2024-01-02 CVE-2023-33114 Use After Free vulnerability in Qualcomm products
Memory corruption while running NPU, when NETWORK_UNLOAD and (NETWORK_UNLOAD or NETWORK_EXECUTE_V2) commands are submitted at the same time.
local
low complexity
qualcomm CWE-416
7.8
2024-01-02 CVE-2023-33117 Use After Free vulnerability in Qualcomm products
Memory corruption when HLOS allocates the response payload buffer to copy the data received from ADSP in response to AVCS_LOAD_MODULE command.
local
low complexity
qualcomm CWE-416
7.8
2024-01-02 CVE-2023-33118 Use After Free vulnerability in Qualcomm products
Memory corruption while processing Listen Sound Model client payload buffer when there is a request for Listen Sound session get parameter from ST HAL.
local
low complexity
qualcomm CWE-416
7.8
2024-01-02 CVE-2023-33120 Use After Free vulnerability in Qualcomm products
Memory corruption in Audio when memory map command is executed consecutively in ADSP.
local
low complexity
qualcomm CWE-416
7.8
2024-01-02 CVE-2023-43511 Infinite Loop vulnerability in Qualcomm products
Transient DOS while parsing IPv6 extension header when WLAN firmware receives an IPv6 packet that contains `IPPROTO_NONE` as the next header.
network
low complexity
qualcomm CWE-835
7.5
2024-01-02 CVE-2023-43514 Use After Free vulnerability in Qualcomm products
Memory corruption while invoking IOCTLs calls from user space for internal mem MAP and internal mem UNMAP.
local
low complexity
qualcomm CWE-416
7.8
2023-12-05 CVE-2023-21634 Out-of-bounds Write vulnerability in Qualcomm products
Memory Corruption in Radio Interface Layer while sending an SMS or writing an SMS to SIM.
local
low complexity
qualcomm CWE-787
7.8
2023-12-05 CVE-2023-22383 Out-of-bounds Write vulnerability in Qualcomm products
Memory Corruption in camera while installing a fd for a particular DMA buffer.
local
low complexity
qualcomm CWE-787
7.8