Vulnerabilities > Qualcomm > Srv1H Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
| 2024-07-01 | CVE-2024-21465 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption while processing key blob passed by the user. | 7.8 |
| 2024-07-01 | CVE-2024-21466 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Information disclosure while parsing sub-IE length during new IE generation. | 7.5 |
| 2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |
| 2024-07-01 | CVE-2024-23372 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while invoking IOCTL call for GPU memory allocation and size param is greater than expected size. | 7.8 |
| 2024-07-01 | CVE-2024-23373 | Use After Free vulnerability in Qualcomm products Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released. | 7.8 |
| 2024-07-01 | CVE-2024-23380 | Use After Free vulnerability in Qualcomm products Memory corruption while handling user packets during VBO bind operation. | 7.8 |
| 2024-05-06 | CVE-2023-33119 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption while loading a VM from a signed VM image that is not coherent in the processor cache. | 7.0 |
| 2024-05-06 | CVE-2023-43521 | Use After Free vulnerability in Qualcomm products Memory corruption when multiple listeners are being registered with the same file descriptor. | 7.8 |
| 2024-05-06 | CVE-2023-43524 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption when the bandpass filter order received from AHAL is not within the expected range. | 7.8 |