Vulnerabilities > Qualcomm > Snapdragon XR1 Platform Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-09-05 | CVE-2023-28538 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WIN Product while invoking WinAcpi update driver in the UEFI region. | 7.8 |
| 2023-09-05 | CVE-2023-28544 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in WLAN while sending transmit command from HLOS to UTF handlers. | 7.8 |
| 2023-09-05 | CVE-2023-28557 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing command parameters from untrusted WMI payload. | 7.8 |
| 2023-09-05 | CVE-2023-28558 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN handler while processing PhyID in Tx status handler. | 7.8 |
| 2023-09-05 | CVE-2023-28559 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN FW while processing command parameters from untrusted WMI payload. | 7.8 |
| 2023-09-05 | CVE-2023-28560 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing devIndex from untrusted WMI payload. | 7.8 |
| 2023-08-08 | CVE-2023-28537 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while allocating memory in COmxApeDec module in Audio. | 7.8 |
| 2023-06-06 | CVE-2022-33264 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message. | 7.8 |
| 2023-06-06 | CVE-2022-40507 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in Core while mapping HLOS address to the list. | 7.8 |
| 2023-06-06 | CVE-2022-40521 | Improper Authentication vulnerability in Qualcomm products Transient DOS due to improper authorization in Modem | 7.5 |