Vulnerabilities > Qualcomm > Snapdragon X75 5G Modem RF Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-04-01 | CVE-2023-33023 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while processing finish_sign command to pass a rsp buffer. | 7.8 |
| 2024-03-04 | CVE-2023-33066 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while processing RT proxy port register driver. | 7.8 |
| 2024-03-04 | CVE-2023-43546 | Use After Free vulnerability in Qualcomm products Memory corruption while invoking HGSL IOCTL context create. | 7.8 |
| 2024-03-04 | CVE-2023-43547 | Use After Free vulnerability in Qualcomm products Memory corruption while invoking IOCTLs calls in Automotive Multimedia. | 7.8 |
| 2024-03-04 | CVE-2023-43549 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while processing TPC target power table in FTM TPC. | 7.8 |