Vulnerabilities > Qualcomm > Snapdragon X75 5G Modem RF Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2025-02-03 | CVE-2024-38420 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while configuring a Hypervisor based input virtual device. | 7.8 |
2025-02-03 | CVE-2024-45571 | Use After Free vulnerability in Qualcomm products Memory corruption may occour occur when stopping the WLAN interface after processing a WMI command from the interface. | 7.8 |
2025-02-03 | CVE-2024-45584 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption can occur when a compat IOCTL call is followed by a normal IOCTL call from userspace. | 7.8 |
2025-02-03 | CVE-2024-49838 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while parsing the OCI IE with invalid length. | 7.5 |
2025-01-06 | CVE-2024-45553 | Use After Free vulnerability in Qualcomm products Memory corruption can occur when process-specific maps are added to the global list. | 7.8 |
2025-01-06 | CVE-2024-45558 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS can occur when the driver parses the per STA profile IE and tries to access the EXTN element ID without checking the IE length. | 7.5 |
2024-09-02 | CVE-2024-38402 | Use After Free vulnerability in Qualcomm products Memory corruption while processing IOCTL call for getting group info. | 7.8 |
2024-06-03 | CVE-2023-43537 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while handling T2LM Action Frame in WLAN Host. | 7.5 |
2024-06-03 | CVE-2023-43538 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in TZ Secure OS while Tunnel Invoke Manager initialization. | 7.8 |
2024-06-03 | CVE-2023-43544 | Use After Free vulnerability in Qualcomm products Memory corruption when IPC callback handle is used after it has been released during register callback by another thread. | 7.8 |