Vulnerabilities > Qualcomm > Snapdragon X12 LTE Modem Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-12-05 | CVE-2023-33107 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call. | 7.8 |
2023-11-07 | CVE-2023-22388 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Multi-mode Call Processor while processing bit mask API. | 9.8 |
2023-11-07 | CVE-2023-33031 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer. | 7.8 |
2023-11-07 | CVE-2023-33055 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Audio while invoking callback function in driver from ADSP. | 7.8 |
2023-11-07 | CVE-2023-33059 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while processing the VOC packet data from ADSP. | 7.8 |
2023-10-03 | CVE-2023-22385 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Data Modem while making a MO call or MT VOLTE call. | 9.8 |
2023-10-03 | CVE-2023-24847 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS in Modem while allocating DSM items. | 7.5 |
2023-10-03 | CVE-2023-24848 | Unspecified vulnerability in Qualcomm products Information Disclosure in Data Modem while performing a VoLTE call with an undefined RTCP FB line value. | 7.5 |
2023-10-03 | CVE-2023-24849 | Unspecified vulnerability in Qualcomm products Information Disclosure in data Modem while parsing an FMTP line in an SDP message. | 7.5 |
2023-10-03 | CVE-2023-33029 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Service during a remote call from HLOS to DSP. | 7.8 |