Vulnerabilities > Qualcomm > Snapdragon Wear 4100 Platform Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-01-02 | CVE-2023-33110 | Race Condition vulnerability in Qualcomm products The session index variable in PCM host voice audio driver initialized before PCM open, accessed during event callback from ADSP and reset during PCM close may lead to race condition between event callback - PCM close and reset session index causing memory corruption. | 7.0 |
| 2024-01-02 | CVE-2023-33114 | Use After Free vulnerability in Qualcomm products Memory corruption while running NPU, when NETWORK_UNLOAD and (NETWORK_UNLOAD or NETWORK_EXECUTE_V2) commands are submitted at the same time. | 7.8 |
| 2023-12-05 | CVE-2023-21634 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Radio Interface Layer while sending an SMS or writing an SMS to SIM. | 7.8 |
| 2023-12-05 | CVE-2023-22383 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in camera while installing a fd for a particular DMA buffer. | 7.8 |
| 2023-12-05 | CVE-2023-22668 | Use After Free vulnerability in Qualcomm products Memory Corruption in Audio while invoking IOCTLs calls from the user-space. | 7.8 |
| 2023-12-05 | CVE-2023-28550 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in MPP performance while accessing DSM watermark using external memory address. | 7.8 |
| 2023-12-05 | CVE-2023-28551 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in UTILS when modem processes memory specific Diag commands having arbitrary address values as input arguments. | 7.8 |
| 2023-12-05 | CVE-2023-33018 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while using the UIM diag command to get the operators name. | 7.8 |
| 2023-12-05 | CVE-2023-33024 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while sending SMS from AP firmware. | 7.8 |
| 2023-12-05 | CVE-2023-33063 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Services during a remote call from HLOS to DSP. | 7.8 |