Vulnerabilities > Qualcomm > Snapdragon Wear 4100 Platform Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-06-06 | CVE-2022-33230 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in FM Host due to buffer copy without checking the size of input in FM Host | 7.8 |
2023-06-06 | CVE-2022-33263 | Use After Free vulnerability in Qualcomm products Memory corruption due to use after free in Core when multiple DCI clients register and deregister. | 7.8 |
2023-06-06 | CVE-2022-33264 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message. | 7.8 |
2023-06-06 | CVE-2022-33267 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Linux while sending DRM request. | 7.8 |
2023-06-06 | CVE-2022-40521 | Improper Authentication vulnerability in Qualcomm products Transient DOS due to improper authorization in Modem | 7.5 |
2023-05-02 | CVE-2023-21665 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory corruption in Graphics while importing a file. | 7.8 |
2023-05-02 | CVE-2023-21666 | Memory Leak vulnerability in Qualcomm products Memory Corruption in Graphics while accessing a buffer allocated through the graphics pool. | 7.8 |
2023-04-13 | CVE-2022-33289 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card. | 6.8 |
2023-04-13 | CVE-2022-33298 | Use After Free vulnerability in Qualcomm products Memory corruption due to use after free in Modem while modem initialization. | 7.8 |
2023-04-13 | CVE-2022-33302 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length. | 7.8 |