Vulnerabilities > Qualcomm > Snapdragon Wear 4100 Platform Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-11-07 | CVE-2023-33031 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer. | 7.8 |
| 2023-11-07 | CVE-2023-33059 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while processing the VOC packet data from ADSP. | 7.8 |
| 2023-10-03 | CVE-2023-22385 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Data Modem while making a MO call or MT VOLTE call. | 9.8 |
| 2023-10-03 | CVE-2023-24848 | Unspecified vulnerability in Qualcomm products Information Disclosure in Data Modem while performing a VoLTE call with an undefined RTCP FB line value. | 7.5 |
| 2023-10-03 | CVE-2023-24849 | Unspecified vulnerability in Qualcomm products Information Disclosure in data Modem while parsing an FMTP line in an SDP message. | 7.5 |
| 2023-08-08 | CVE-2023-28537 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while allocating memory in COmxApeDec module in Audio. | 7.8 |
| 2023-06-06 | CVE-2022-22076 | Unspecified vulnerability in Qualcomm products information disclosure due to cryptographic issue in Core during RPMB read request. | 5.5 |
| 2023-06-06 | CVE-2022-33224 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in core due to buffer copy without check9ing the size of input while processing ioctl queries. | 7.8 |
| 2023-06-06 | CVE-2022-33226 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking the size of input in Core while processing ioctl commands from diag client applications. | 7.8 |
| 2023-06-06 | CVE-2022-33227 | Double Free vulnerability in Qualcomm products Memory corruption in Linux android due to double free while calling unregister provider after register call. | 7.8 |