Vulnerabilities > Qualcomm > Snapdragon Wear 1300 Platform Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-10-03 | CVE-2023-22385 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Data Modem while making a MO call or MT VOLTE call. | 9.8 |
| 2023-06-06 | CVE-2022-22076 | Unspecified vulnerability in Qualcomm products information disclosure due to cryptographic issue in Core during RPMB read request. | 5.5 |
| 2023-06-06 | CVE-2022-40507 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in Core while mapping HLOS address to the list. | 7.8 |
| 2023-06-06 | CVE-2022-40521 | Improper Authentication vulnerability in Qualcomm products Transient DOS due to improper authorization in Modem | 7.5 |
| 2023-06-06 | CVE-2022-40523 | Exposure of Resource to Wrong Sphere vulnerability in Qualcomm products Information disclosure in Kernel due to indirect branch misprediction. | 5.5 |
| 2023-05-02 | CVE-2022-33304 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS due to NULL pointer dereference in Modem while performing pullup for received TCP/UDP packet. | 7.5 |
| 2023-05-02 | CVE-2022-40505 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read in Modem while parsing DNS hostname. | 7.5 |
| 2023-04-13 | CVE-2022-33287 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in Modem due to buffer over-read while getting length of Unfragmented headers in an IPv6 packet. | 7.5 |
| 2023-04-13 | CVE-2022-33289 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card. | 6.8 |
| 2023-04-13 | CVE-2022-33291 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in Modem due to buffer over-read while receiving a IP header with malformed length. | 7.5 |