Vulnerabilities > Qualcomm > Snapdragon W5 GEN 1 Wearable Platform Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-11-07 | CVE-2023-33055 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Audio while invoking callback function in driver from ADSP. | 7.8 |
| 2023-11-07 | CVE-2023-33059 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while processing the VOC packet data from ADSP. | 7.8 |
| 2023-11-07 | CVE-2023-33074 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio when SSR event is triggered after music playback is stopped. | 7.8 |
| 2023-10-03 | CVE-2023-24847 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS in Modem while allocating DSM items. | 7.5 |
| 2023-10-03 | CVE-2023-24848 | Unspecified vulnerability in Qualcomm products Information Disclosure in Data Modem while performing a VoLTE call with an undefined RTCP FB line value. | 7.5 |
| 2023-10-03 | CVE-2023-24849 | Unspecified vulnerability in Qualcomm products Information Disclosure in data Modem while parsing an FMTP line in an SDP message. | 7.5 |
| 2023-10-03 | CVE-2023-24850 | Improper Validation of Array Index vulnerability in Qualcomm products Memory Corruption in HLOS while importing a cryptographic key into KeyMaster Trusted Application. | 7.8 |
| 2023-10-03 | CVE-2023-28539 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in WLAN Host when the firmware invokes multiple WMI Service Available command. | 7.8 |
| 2023-10-03 | CVE-2023-28540 | Improper Authentication vulnerability in Qualcomm products Cryptographic issue in Data Modem due to improper authentication during TLS handshake. | 7.5 |
| 2023-10-03 | CVE-2023-33027 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing rsn ies. | 7.5 |