Vulnerabilities > Qualcomm > Snapdragon W5 GEN 1 Wearable Platform Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-08-05 | CVE-2024-21467 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while handling beacon probe frame during scan entry generation in client side. | 7.5 |
| 2024-08-05 | CVE-2024-23381 | Use After Free vulnerability in Qualcomm products Memory corruption when memory mapped in a VBO is not unmapped by the GPU SMMU. | 7.8 |
| 2024-08-05 | CVE-2024-23382 | Use After Free vulnerability in Qualcomm products Memory corruption while processing graphics kernel driver request to create DMA fence. | 7.8 |
| 2024-08-05 | CVE-2024-23383 | Use After Free vulnerability in Qualcomm products Memory corruption when kernel driver attempts to trigger hardware fences. | 7.8 |
| 2024-08-05 | CVE-2024-33021 | Use of Uninitialized Resource vulnerability in Qualcomm products Memory corruption while processing IOCTL call to set metainfo. | 7.8 |
| 2024-08-05 | CVE-2024-33022 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while allocating memory in HGSL driver. | 7.8 |
| 2024-08-05 | CVE-2024-33023 | Use After Free vulnerability in Qualcomm products Memory corruption while creating a fence to wait on timeline events, and simultaneously signal timeline events. | 7.8 |
| 2024-08-05 | CVE-2024-33028 | Use After Free vulnerability in Qualcomm products Memory corruption as fence object may still be accessed in timeline destruct after isync fence is released. | 7.8 |
| 2024-08-05 | CVE-2024-33034 | Use After Free vulnerability in Qualcomm products Memory corruption can occur if VBOs hold outdated or invalid GPU SMMU mappings, especially when the binding and reclaiming of memory buffers are performed at the same time. | 7.8 |
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |