Vulnerabilities > Qualcomm > Snapdragon W5 GEN 1 Wearable Platform Firmware

DATE CVE VULNERABILITY TITLE RISK
2024-01-02 CVE-2023-33094 Use After Free vulnerability in Qualcomm products
Memory corruption while running VK synchronization with KASAN enabled.
local
low complexity
qualcomm CWE-416
7.8
2024-01-02 CVE-2023-33108 Use After Free vulnerability in Qualcomm products
Memory corruption in Graphics Driver when destroying a context with KGSL_GPU_AUX_COMMAND_TIMELINE objects queued.
local
low complexity
qualcomm CWE-416
7.8
2024-01-02 CVE-2023-33109 NULL Pointer Dereference vulnerability in Qualcomm products
Transient DOS while processing a WMI P2P listen start command (0xD00A) sent from host.
network
low complexity
qualcomm CWE-476
7.5
2024-01-02 CVE-2023-33110 Race Condition vulnerability in Qualcomm products
The session index variable in PCM host voice audio driver initialized before PCM open, accessed during event callback from ADSP and reset during PCM close may lead to race condition between event callback - PCM close and reset session index causing memory corruption.
local
high complexity
qualcomm CWE-362
7.0
2024-01-02 CVE-2023-33112 Unspecified vulnerability in Qualcomm products
Transient DOS when WLAN firmware receives "reassoc response" frame including RIC_DATA element.
network
low complexity
qualcomm
7.5
2024-01-02 CVE-2023-33113 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption when resource manager sends the host kernel a reply message with multiple fragments.
local
low complexity
qualcomm CWE-787
7.8
2024-01-02 CVE-2023-33114 Use After Free vulnerability in Qualcomm products
Memory corruption while running NPU, when NETWORK_UNLOAD and (NETWORK_UNLOAD or NETWORK_EXECUTE_V2) commands are submitted at the same time.
local
low complexity
qualcomm CWE-416
7.8
2024-01-02 CVE-2023-33117 Use After Free vulnerability in Qualcomm products
Memory corruption when HLOS allocates the response payload buffer to copy the data received from ADSP in response to AVCS_LOAD_MODULE command.
local
low complexity
qualcomm CWE-416
7.8
2024-01-02 CVE-2023-33118 Use After Free vulnerability in Qualcomm products
Memory corruption while processing Listen Sound Model client payload buffer when there is a request for Listen Sound session get parameter from ST HAL.
local
low complexity
qualcomm CWE-416
7.8
2024-01-02 CVE-2023-33120 Use After Free vulnerability in Qualcomm products
Memory corruption in Audio when memory map command is executed consecutively in ADSP.
local
low complexity
qualcomm CWE-416
7.8