Vulnerabilities > Qualcomm > Snapdragon W5 GEN 1 Wearable Platform Firmware

DATE CVE VULNERABILITY TITLE RISK
2024-10-07 CVE-2024-23376 Use After Free vulnerability in Qualcomm products
Memory corruption while sending the persist buffer command packet from the user-space to the kernel space through the IOCTL call.
local
low complexity
qualcomm CWE-416
6.7
2024-10-07 CVE-2024-33049 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS while parsing noninheritance IE of Extension element when length of IE is 2 of beacon frame.
network
low complexity
qualcomm CWE-125
7.5
2024-08-05 CVE-2024-33014 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS while parsing ESP IE from beacon/probe response frame.
network
low complexity
qualcomm CWE-125
7.5
2024-08-05 CVE-2024-33015 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS while parsing SCAN RNR IE when bytes received from AP is such that the size of the last param of IE is less than neighbor report.
network
low complexity
qualcomm CWE-125
7.5
2024-08-05 CVE-2024-33021 Use of Uninitialized Resource vulnerability in Qualcomm products
Memory corruption while processing IOCTL call to set metainfo.
local
low complexity
qualcomm CWE-908
7.8
2024-08-05 CVE-2024-33022 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption while allocating memory in HGSL driver.
local
low complexity
qualcomm CWE-190
7.8
2024-08-05 CVE-2024-33023 Use After Free vulnerability in Qualcomm products
Memory corruption while creating a fence to wait on timeline events, and simultaneously signal timeline events.
local
low complexity
qualcomm CWE-416
7.8
2024-08-05 CVE-2024-33028 Use After Free vulnerability in Qualcomm products
Memory corruption as fence object may still be accessed in timeline destruct after isync fence is released.
local
low complexity
qualcomm CWE-416
7.8
2024-08-05 CVE-2024-33034 Use After Free vulnerability in Qualcomm products
Memory corruption can occur if VBOs hold outdated or invalid GPU SMMU mappings, especially when the binding and reclaiming of memory buffers are performed at the same time.
local
low complexity
qualcomm CWE-416
7.8
2024-07-01 CVE-2024-21461 Double Free vulnerability in Qualcomm products
Memory corruption while performing finish HMAC operation when context is freed by keymaster.
local
low complexity
qualcomm CWE-415
7.8