Vulnerabilities > Qualcomm > Snapdragon W5 GEN 1 Wearable Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2025-02-03 | CVE-2024-38418 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption while parsing the memory map info in IOCTL calls. | 7.0 |
| 2025-02-03 | CVE-2024-45584 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption can occur when a compat IOCTL call is followed by a normal IOCTL call from userspace. | 7.8 |
| 2025-02-03 | CVE-2024-49834 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption while power-up or power-down sequence of the camera sensor. | 7.8 |
| 2025-02-03 | CVE-2024-49838 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while parsing the OCI IE with invalid length. | 7.5 |
| 2025-02-03 | CVE-2024-49843 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption while processing IOCTL from user space to handle GPU AHB bus error. | 7.8 |
| 2025-01-06 | CVE-2024-45553 | Use After Free vulnerability in Qualcomm products Memory corruption can occur when process-specific maps are added to the global list. | 7.8 |
| 2024-09-02 | CVE-2024-33050 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper. | 7.5 |
| 2024-09-02 | CVE-2024-33051 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing TIM IE from beacon frame as there is no check for IE length. | 7.5 |
| 2024-09-02 | CVE-2024-33060 | Use After Free vulnerability in Qualcomm products Memory corruption when two threads try to map and unmap a single node simultaneously. | 7.8 |
| 2024-09-02 | CVE-2024-38401 | Use After Free vulnerability in Qualcomm products Memory corruption while processing concurrent IOCTL calls. | 7.8 |