Vulnerabilities > Qualcomm > Snapdragon High MED 2016 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2019-01-03 | CVE-2017-18141 | Unspecified vulnerability in Qualcomm products When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | 7.8 |
| 2018-10-29 | CVE-2018-11871 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Buffer overwrite can happen in WLAN function while processing set pdev parameter command due to lack of input validation in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version IPQ4019, IPQ8064, IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA9377, QCA9378, QCA9379, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016. | 7.8 |
| 2018-10-29 | CVE-2018-11866 | Integer Overflow or Wraparound vulnerability in Qualcomm products Integer overflow may happen in WLAN when calculating an internal structure size due to lack of validation of the input length in Snapdragon Mobile, Snapdragon Wear in version IPQ8074, MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016. | 7.8 |
| 2018-10-29 | CVE-2018-11865 | Integer Overflow or Wraparound vulnerability in Qualcomm products Integer overflow may happen when calculating an internal structure size due to lack of validation of the input length in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016. | 7.8 |
| 2018-09-20 | CVE-2018-11267 | Improper Validation of Array Index vulnerability in Qualcomm products In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20. | 7.8 |
| 2018-07-06 | CVE-2018-5892 | Information Exposure vulnerability in Qualcomm products The Touch Pal application can collect user behavior data without awareness by the user in Snapdragon Mobile and Snapdragon Wear. | 7.5 |
| 2018-07-06 | CVE-2018-11259 | Incorrect Permission Assignment for Critical Resource vulnerability in Qualcomm products Due to Improper Access Control of NAND-based EFS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, From fastboot on a NAND-based device, the EFS partition can be erased. | 7.7 |