Vulnerabilities > Qualcomm > Snapdragon Auto 5G Modem RF GEN 2 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-08-05 | CVE-2024-33021 | Use of Uninitialized Resource vulnerability in Qualcomm products Memory corruption while processing IOCTL call to set metainfo. | 7.8 |
| 2024-08-05 | CVE-2024-33022 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while allocating memory in HGSL driver. | 7.8 |
| 2024-08-05 | CVE-2024-33024 | Integer Overflow or Wraparound vulnerability in Qualcomm products Transient DOS while parsing the ML IE when a beacon with length field inside the common info of ML IE greater than the ML IE length. | 7.5 |
| 2024-08-05 | CVE-2024-33025 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the BSS parameter change count or MLD capabilities fields of the ML IE. | 7.5 |
| 2024-08-05 | CVE-2024-33028 | Use After Free vulnerability in Qualcomm products Memory corruption as fence object may still be accessed in timeline destruct after isync fence is released. | 7.8 |
| 2024-07-01 | CVE-2024-21457 | Out-of-bounds Read vulnerability in Qualcomm products INformation disclosure while handling Multi-link IE in beacon frame. | 7.5 |
| 2024-07-01 | CVE-2024-21458 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while handling SA query action frame. | 7.5 |
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
| 2024-07-01 | CVE-2024-21465 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption while processing key blob passed by the user. | 7.8 |
| 2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |