Vulnerabilities > Qualcomm > Snapdragon Auto 5G Modem RF GEN 2 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2025-02-03 | CVE-2024-38416 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure during audio playback. | 5.5 |
2025-02-03 | CVE-2024-38417 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while processing IO control commands. | 5.5 |
2025-02-03 | CVE-2024-38420 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while configuring a Hypervisor based input virtual device. | 7.8 |
2025-02-03 | CVE-2024-45569 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption while parsing the ML IE due to invalid frame content. | 9.8 |
2025-02-03 | CVE-2024-45584 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption can occur when a compat IOCTL call is followed by a normal IOCTL call from userspace. | 7.8 |
2025-02-03 | CVE-2024-49838 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while parsing the OCI IE with invalid length. | 7.5 |
2025-02-03 | CVE-2024-49839 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption during management frame processing due to mismatch in T2LM info element. | 9.8 |
2025-01-06 | CVE-2024-33067 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while invoking callback function of sound model driver from ADSP for every valid opcode received from sound model driver. | 5.5 |
2025-01-06 | CVE-2024-45553 | Use After Free vulnerability in Qualcomm products Memory corruption can occur when process-specific maps are added to the global list. | 7.8 |
2025-01-06 | CVE-2024-45558 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS can occur when the driver parses the per STA profile IE and tries to access the EXTN element ID without checking the IE length. | 7.5 |