Vulnerabilities > Qualcomm > Snapdragon AR2 GEN 1 Platform Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-09-05 | CVE-2023-28557 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing command parameters from untrusted WMI payload. | 7.8 |
| 2023-09-05 | CVE-2023-28558 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN handler while processing PhyID in Tx status handler. | 7.8 |
| 2023-08-08 | CVE-2023-28555 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in Audio while remapping channel buffer in media codec decoding. | 7.5 |
| 2023-06-06 | CVE-2022-33307 | Double Free vulnerability in Qualcomm products Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed. | 7.8 |
| 2023-06-06 | CVE-2022-40507 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in Core while mapping HLOS address to the list. | 7.8 |
| 2023-06-06 | CVE-2022-40529 | Incorrect Authorization vulnerability in Qualcomm products Memory corruption due to improper access control in kernel while processing a mapping request from root process. | 7.8 |
| 2023-06-06 | CVE-2023-21656 | Improper Input Validation vulnerability in Qualcomm products Memory corruption in WLAN HOST while receiving an WMI event from firmware. | 7.8 |
| 2023-06-06 | CVE-2023-21658 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while processing the received beacon or probe response frame. | 7.5 |
| 2023-06-06 | CVE-2023-21659 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while processing frames with missing header fields. | 7.5 |
| 2023-06-06 | CVE-2023-21660 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing FT Information Elements. | 7.5 |