Vulnerabilities > Qualcomm > Snapdragon AR2 GEN 1 Platform Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-11-07 | CVE-2023-33048 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing t2lm buffers. | 7.5 |
| 2023-11-07 | CVE-2023-33056 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS in WLAN Firmware when firmware receives beacon including T2LM IE. | 7.5 |
| 2023-11-07 | CVE-2023-33061 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing WLAN beacon or probe-response frame. | 7.5 |
| 2023-10-03 | CVE-2023-21673 | Unspecified vulnerability in Qualcomm products Improper Access to the VM resource manager can lead to Memory Corruption. | 7.8 |
| 2023-10-03 | CVE-2023-24850 | Improper Validation of Array Index vulnerability in Qualcomm products Memory Corruption in HLOS while importing a cryptographic key into KeyMaster Trusted Application. | 7.8 |
| 2023-10-03 | CVE-2023-24853 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in HLOS while registering for key provisioning notify. | 7.8 |
| 2023-10-03 | CVE-2023-33026 | Resource Exhaustion vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing a NAN management frame. | 7.5 |
| 2023-10-03 | CVE-2023-33027 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing rsn ies. | 7.5 |
| 2023-10-03 | CVE-2023-33028 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN Firmware while doing a memory copy of pmk cache. | 9.8 |
| 2023-10-03 | CVE-2023-33029 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Service during a remote call from HLOS to DSP. | 7.8 |