Vulnerabilities > Qualcomm > Snapdragon AR2 GEN 1 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-09-02 | CVE-2024-33051 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing TIM IE from beacon frame as there is no check for IE length. | 7.5 |
| 2024-09-02 | CVE-2024-33057 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the multi-link element Control field when common information length check is missing before updating the location. | 7.5 |
| 2024-09-02 | CVE-2024-33060 | Use After Free vulnerability in Qualcomm products Memory corruption when two threads try to map and unmap a single node simultaneously. | 7.8 |
| 2024-09-02 | CVE-2024-38402 | Use After Free vulnerability in Qualcomm products Memory corruption while processing IOCTL call for getting group info. | 7.8 |
| 2024-06-03 | CVE-2023-43537 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while handling T2LM Action Frame in WLAN Host. | 7.5 |
| 2024-06-03 | CVE-2023-43538 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in TZ Secure OS while Tunnel Invoke Manager initialization. | 7.8 |
| 2024-06-03 | CVE-2023-43556 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Hypervisor when platform information mentioned is not aligned. | 8.8 |
| 2024-05-06 | CVE-2023-33119 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption while loading a VM from a signed VM image that is not coherent in the processor cache. | 7.0 |
| 2024-05-06 | CVE-2023-43530 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in HLOS while checking for the storage type. | 7.8 |
| 2024-05-06 | CVE-2023-43531 | Access of Uninitialized Pointer vulnerability in Qualcomm products Memory corruption while verifying the serialized header when the key pairs are generated. | 7.8 |