Vulnerabilities > Qualcomm > Snapdragon AR2 GEN 1 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2025-02-03 | CVE-2024-38420 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while configuring a Hypervisor based input virtual device. | 7.8 |
| 2025-02-03 | CVE-2024-49833 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption can occur in the camera when an invalid CID is used. | 7.8 |
| 2025-02-03 | CVE-2024-49834 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption while power-up or power-down sequence of the camera sensor. | 7.8 |
| 2025-02-03 | CVE-2024-49838 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while parsing the OCI IE with invalid length. | 7.5 |
| 2025-01-06 | CVE-2024-33055 | Use After Free vulnerability in Qualcomm products Memory corruption while invoking IOCTL calls to unmap the DMA buffers. | 7.8 |
| 2025-01-06 | CVE-2024-45553 | Use After Free vulnerability in Qualcomm products Memory corruption can occur when process-specific maps are added to the global list. | 7.8 |
| 2024-09-02 | CVE-2024-33038 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while passing untrusted/corrupted pointers from DSP to EVA. | 7.8 |
| 2024-09-02 | CVE-2024-33045 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when BTFM client sends new messages over Slimbus to ADSP. | 7.8 |
| 2024-09-02 | CVE-2024-33048 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the received TID-to-link mapping element of beacon/probe response frame. | 7.5 |
| 2024-09-02 | CVE-2024-33050 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper. | 7.5 |