Vulnerabilities > Qualcomm > Snapdragon 888 5G Mobile Platform Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-01-02 | CVE-2023-33037 | Missing Encryption of Sensitive Data vulnerability in Qualcomm products Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data. | 5.5 |
| 2024-01-02 | CVE-2023-33038 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while receiving a message in Bus Socket Transport Server. | 7.8 |
| 2024-01-02 | CVE-2023-33040 | Unspecified vulnerability in Qualcomm products Transient DOS in Data Modem during DTLS handshake. | 7.5 |
| 2024-01-02 | CVE-2023-33062 | Unspecified vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing a BTM request. | 7.5 |
| 2024-01-02 | CVE-2023-33085 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in wearables while processing data from AON. | 7.8 |
| 2024-01-02 | CVE-2023-33094 | Use After Free vulnerability in Qualcomm products Memory corruption while running VK synchronization with KASAN enabled. | 7.8 |
| 2024-01-02 | CVE-2023-33109 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS while processing a WMI P2P listen start command (0xD00A) sent from host. | 7.5 |
| 2024-01-02 | CVE-2023-33110 | Race Condition vulnerability in Qualcomm products The session index variable in PCM host voice audio driver initialized before PCM open, accessed during event callback from ADSP and reset during PCM close may lead to race condition between event callback - PCM close and reset session index causing memory corruption. | 7.0 |
| 2024-01-02 | CVE-2023-33112 | Unspecified vulnerability in Qualcomm products Transient DOS when WLAN firmware receives "reassoc response" frame including RIC_DATA element. | 7.5 |
| 2024-01-02 | CVE-2023-33113 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when resource manager sends the host kernel a reply message with multiple fragments. | 7.8 |