Vulnerabilities > Qualcomm > Snapdragon 870 5G Mobile Platform Sm8250 AC Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-10-07 | CVE-2024-23369 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption when invalid length is provided from HLOS for FRS/UDS request/response buffers. | 7.8 |
| 2024-10-07 | CVE-2024-33069 | Use After Free vulnerability in Qualcomm products Transient DOS when transmission of management frame sent by host is not successful and error status is received in the host. | 7.5 |
| 2024-08-05 | CVE-2024-21459 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while handling beacon or probe response frame in STA. | 7.5 |
| 2024-08-05 | CVE-2024-21467 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while handling beacon probe frame during scan entry generation in client side. | 7.5 |
| 2024-08-05 | CVE-2024-23355 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when keymaster operation imports a shared key. | 7.8 |