Vulnerabilities > Qualcomm > Snapdragon 835 Mobile Platform Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-04-13 | CVE-2022-33289 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card. | 6.8 |
| 2023-04-13 | CVE-2022-33296 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow to buffer overflow in Modem while parsing Traffic Channel Neighbor List Update message. | 7.8 |
| 2023-04-13 | CVE-2022-33297 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer overread in Linux sensors | 5.5 |
| 2023-04-13 | CVE-2022-33298 | Use After Free vulnerability in Qualcomm products Memory corruption due to use after free in Modem while modem initialization. | 7.8 |
| 2023-04-13 | CVE-2022-33302 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length. | 7.8 |
| 2023-04-13 | CVE-2022-40503 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read in Bluetooth Host while A2DP streaming. | 7.5 |
| 2023-04-13 | CVE-2022-40532 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target. | 7.8 |