Vulnerabilities > Qualcomm > Snapdragon 835 Mobile PC Platform Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-11-04 | CVE-2024-38422 | Unspecified vulnerability in Qualcomm products Memory corruption while processing voice packet with arbitrary data received from ADSP. | 7.8 |
| 2024-11-04 | CVE-2024-38423 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while processing GPU page table switch. | 7.8 |
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
| 2024-07-01 | CVE-2024-23373 | Use After Free vulnerability in Qualcomm products Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released. | 7.8 |
| 2024-07-01 | CVE-2024-23380 | Use After Free vulnerability in Qualcomm products Memory corruption while handling user packets during VBO bind operation. | 7.8 |
| 2024-02-06 | CVE-2023-33067 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points. | 7.8 |
| 2024-02-06 | CVE-2023-33068 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Audio while processing IIR config data from AFE calibration block. | 7.8 |
| 2024-02-06 | CVE-2023-33069 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Audio while processing the calibration data returned from ACDB loader. | 7.8 |
| 2024-02-06 | CVE-2023-33077 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in HLOS while converting from authorization token to HIDL vector. | 7.8 |
| 2024-02-06 | CVE-2023-33065 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in Audio while accessing AVCS services from ADSP payload. | 7.1 |