Vulnerabilities > Qualcomm > Snapdragon 821 Mobile Platform Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
| 2024-01-02 | CVE-2023-33030 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in HLOS while running playready use-case. | 7.8 |
| 2024-01-02 | CVE-2023-33110 | Race Condition vulnerability in Qualcomm products The session index variable in PCM host voice audio driver initialized before PCM open, accessed during event callback from ADSP and reset during PCM close may lead to race condition between event callback - PCM close and reset session index causing memory corruption. | 7.0 |
| 2024-01-02 | CVE-2023-43511 | Infinite Loop vulnerability in Qualcomm products Transient DOS while parsing IPv6 extension header when WLAN firmware receives an IPv6 packet that contains `IPPROTO_NONE` as the next header. | 7.5 |
| 2023-12-05 | CVE-2023-28546 | Classic Buffer Overflow vulnerability in Qualcomm products Memory Corruption in SPS Application while exporting public key in sorter TA. | 7.8 |
| 2023-12-05 | CVE-2023-28586 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE. | 6.5 |
| 2023-12-05 | CVE-2023-33080 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. | 7.5 |
| 2023-11-07 | CVE-2023-33059 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while processing the VOC packet data from ADSP. | 7.8 |
| 2023-09-05 | CVE-2023-28560 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing devIndex from untrusted WMI payload. | 7.8 |
| 2023-06-06 | CVE-2022-22076 | Unspecified vulnerability in Qualcomm products information disclosure due to cryptographic issue in Core during RPMB read request. | 5.5 |