Vulnerabilities > Qualcomm > Snapdragon 8 GEN 3 Mobile Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-04-01 | CVE-2023-28547 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in SPS Application while requesting for public key in sorter TA. | 7.8 |
| 2024-04-01 | CVE-2023-33023 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while processing finish_sign command to pass a rsp buffer. | 7.8 |
| 2024-03-04 | CVE-2023-28578 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Core Services while executing the command for removing a single event listener. | 7.8 |
| 2024-03-04 | CVE-2023-33066 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while processing RT proxy port register driver. | 7.8 |
| 2024-03-04 | CVE-2023-43549 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while processing TPC target power table in FTM TPC. | 7.8 |