Vulnerabilities > Qualcomm > Snapdragon 8 GEN 2 Mobile Platform Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-11-04 | CVE-2024-33033 | Use After Free vulnerability in Qualcomm products Memory corruption while processing IOCTL calls to unmap the buffers. | 7.8 |
| 2024-11-04 | CVE-2024-38415 | Use After Free vulnerability in Qualcomm products Memory corruption while handling session errors from firmware. | 7.8 |
| 2024-11-04 | CVE-2024-38419 | Use After Free vulnerability in Qualcomm products Memory corruption while invoking IOCTL calls from the use-space for HGSL memory node. | 7.8 |
| 2024-11-04 | CVE-2024-38422 | Unspecified vulnerability in Qualcomm products Memory corruption while processing voice packet with arbitrary data received from ADSP. | 7.8 |
| 2024-11-04 | CVE-2024-38424 | Use After Free vulnerability in Qualcomm products Memory corruption during GNSS HAL process initialization. | 7.8 |
| 2024-10-07 | CVE-2024-33073 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while parsing the BSS parameter change count or MLD capabilities fields of the ML IE. | 8.2 |
| 2024-10-07 | CVE-2024-38397 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing probe response and assoc response frame. | 7.5 |
| 2024-08-05 | CVE-2024-33014 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing ESP IE from beacon/probe response frame. | 7.5 |
| 2024-08-05 | CVE-2024-33015 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing SCAN RNR IE when bytes received from AP is such that the size of the last param of IE is less than neighbor report. | 7.5 |
| 2024-08-05 | CVE-2024-33018 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the received TID-to-link mapping element of the TID-to-link mapping action frame. | 7.5 |