Vulnerabilities > Qualcomm > Snapdragon 8 GEN 2 Mobile Platform Firmware

DATE CVE VULNERABILITY TITLE RISK
2023-12-05 CVE-2023-28587 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level.
local
low complexity
qualcomm CWE-787
7.8
2023-12-05 CVE-2023-28588 Integer Overflow or Wraparound vulnerability in Qualcomm products
Transient DOS in Bluetooth Host while rfc slot allocation.
network
low complexity
qualcomm CWE-190
7.5
2023-12-05 CVE-2023-33017 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption in Boot while running a ListVars test in UEFI Menu during boot.
local
low complexity
qualcomm CWE-120
7.8
2023-12-05 CVE-2023-33018 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption while using the UIM diag command to get the operators name.
local
low complexity
qualcomm CWE-190
7.8
2023-12-05 CVE-2023-33022 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption in HLOS while invoking IOCTL calls from user-space.
local
low complexity
qualcomm CWE-190
7.8
2023-12-05 CVE-2023-33041 Reachable Assertion vulnerability in Qualcomm products
Under certain scenarios the WLAN Firmware will reach an assertion due to state confusion while looking up peer ids.
network
low complexity
qualcomm CWE-617
7.5
2023-12-05 CVE-2023-33043 Reachable Assertion vulnerability in Qualcomm products
Transient DOS in Modem when a Beam switch request is made with a non-configured BWP.
network
low complexity
qualcomm CWE-617
7.5
2023-12-05 CVE-2023-33044 Reachable Assertion vulnerability in Qualcomm products
Transient DOS in Data modem while handling TLB control messages from the Network.
network
low complexity
qualcomm CWE-617
7.5
2023-12-05 CVE-2023-33054 Improper Authentication vulnerability in Qualcomm products
Cryptographic issue in GPS HLOS Driver while downloading Qualcomm GNSS assistance data.
network
low complexity
qualcomm CWE-287
critical
9.1
2023-12-05 CVE-2023-33063 Use After Free vulnerability in Qualcomm products
Memory corruption in DSP Services during a remote call from HLOS to DSP.
local
low complexity
qualcomm CWE-416
7.8