Vulnerabilities > Qualcomm > Snapdragon 8 GEN 2 Mobile Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2025-01-06 | CVE-2024-33059 | Use After Free vulnerability in Qualcomm products Memory corruption while processing frame command IOCTL calls. | 7.8 |
2025-01-06 | CVE-2024-45553 | Use After Free vulnerability in Qualcomm products Memory corruption can occur when process-specific maps are added to the global list. | 7.8 |
2025-01-06 | CVE-2024-45558 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS can occur when the driver parses the per STA profile IE and tries to access the EXTN element ID without checking the IE length. | 7.5 |
2024-09-02 | CVE-2024-33048 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the received TID-to-link mapping element of beacon/probe response frame. | 7.5 |
2024-09-02 | CVE-2024-33052 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when user provides data for FM HCI command control operations. | 7.8 |
2024-09-02 | CVE-2024-33054 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption during the handshake between the Primary Virtual Machine and Trusted Virtual Machine. | 7.8 |
2024-09-02 | CVE-2024-33057 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the multi-link element Control field when common information length check is missing before updating the location. | 7.5 |
2024-09-02 | CVE-2024-33060 | Use After Free vulnerability in Qualcomm products Memory corruption when two threads try to map and unmap a single node simultaneously. | 7.8 |
2024-09-02 | CVE-2024-38402 | Use After Free vulnerability in Qualcomm products Memory corruption while processing IOCTL call for getting group info. | 7.8 |
2024-06-03 | CVE-2023-43537 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while handling T2LM Action Frame in WLAN Host. | 7.5 |