Vulnerabilities > Qualcomm > Snapdragon 8 GEN 1 Mobile Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2025-05-06 | CVE-2025-21468 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer. | 7.8 |
| 2025-02-03 | CVE-2024-38414 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while processing information on firmware image during core initialization. | 5.5 |
| 2025-02-03 | CVE-2024-38417 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while processing IO control commands. | 5.5 |
| 2025-02-03 | CVE-2024-38418 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption while parsing the memory map info in IOCTL calls. | 7.0 |
| 2025-02-03 | CVE-2024-38420 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while configuring a Hypervisor based input virtual device. | 7.8 |
| 2025-02-03 | CVE-2024-45582 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption while validating number of devices in Camera kernel . | 7.8 |
| 2025-02-03 | CVE-2024-49832 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in Camera due to unusually high number of nodes passed to AXI port. | 7.8 |
| 2025-02-03 | CVE-2024-49833 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption can occur in the camera when an invalid CID is used. | 7.8 |
| 2025-02-03 | CVE-2024-49834 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption while power-up or power-down sequence of the camera sensor. | 7.8 |
| 2025-02-03 | CVE-2024-49838 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while parsing the OCI IE with invalid length. | 7.5 |