Vulnerabilities > Qualcomm > Snapdragon 8 GEN 1 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-09-02 | CVE-2024-33038 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while passing untrusted/corrupted pointers from DSP to EVA. | 7.8 |
| 2024-09-02 | CVE-2024-33042 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when Alternative Frequency offset value is set to 255. | 7.8 |
| 2024-09-02 | CVE-2024-33045 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when BTFM client sends new messages over Slimbus to ADSP. | 7.8 |
| 2024-09-02 | CVE-2024-33050 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper. | 7.5 |
| 2024-09-02 | CVE-2024-33051 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing TIM IE from beacon frame as there is no check for IE length. | 7.5 |
| 2023-09-05 | CVE-2023-28567 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while handling command through WMI interfaces. | 7.8 |
| 2023-09-05 | CVE-2023-28573 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while parsing WMI command parameters. | 7.8 |
| 2023-09-05 | CVE-2023-28584 | Unspecified vulnerability in Qualcomm products Transient DOS in WLAN Host when a mobile station receives invalid channel in CSA IE while doing channel switch announcement (CSA). | 7.5 |
| 2023-09-05 | CVE-2023-33015 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while interpreting MBSSID IE of a received beacon frame. | 7.5 |
| 2023-09-05 | CVE-2023-33016 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN firmware while parsing MLO (multi-link operation). | 7.5 |