Vulnerabilities > Qualcomm > Snapdragon 7C GEN 3 Compute Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-10-03 | CVE-2023-33027 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing rsn ies. | 7.5 |
2023-10-03 | CVE-2023-33029 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Service during a remote call from HLOS to DSP. | 7.8 |
2023-10-03 | CVE-2023-33034 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while parsing the ADSP response command. | 7.8 |
2023-10-03 | CVE-2023-33035 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while invoking callback function of AFE from ADSP. | 7.8 |
2023-09-05 | CVE-2022-33275 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in WLAN HAL when received lm_itemNum is out of range. | 7.8 |
2023-09-05 | CVE-2023-28548 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing Tx/Rx commands from QDART. | 7.8 |
2023-09-05 | CVE-2023-28549 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in WLAN HAL while parsing Rx buffer in processing TLV payload. | 7.8 |
2023-09-05 | CVE-2023-28557 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing command parameters from untrusted WMI payload. | 7.8 |
2023-06-06 | CVE-2022-22060 | Reachable Assertion vulnerability in Qualcomm products Assertion occurs while processing Reconfiguration message due to improper validation | 7.5 |
2023-06-06 | CVE-2022-33251 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem because of invalid network configuration. | 7.5 |