Vulnerabilities > Qualcomm > Snapdragon 778G 5G Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-09-02 | CVE-2024-33042 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when Alternative Frequency offset value is set to 255. | 7.8 |
| 2024-09-02 | CVE-2024-33045 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when BTFM client sends new messages over Slimbus to ADSP. | 7.8 |
| 2024-09-02 | CVE-2024-33050 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper. | 7.5 |
| 2024-09-02 | CVE-2024-33051 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing TIM IE from beacon frame as there is no check for IE length. | 7.5 |
| 2023-09-05 | CVE-2023-28567 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while handling command through WMI interfaces. | 7.8 |
| 2023-09-05 | CVE-2023-28573 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while parsing WMI command parameters. | 7.8 |
| 2023-09-05 | CVE-2023-33015 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while interpreting MBSSID IE of a received beacon frame. | 7.5 |
| 2023-09-05 | CVE-2023-33021 | Use After Free vulnerability in Qualcomm products Memory corruption in Graphics while processing user packets for command submission. | 7.8 |
| 2023-07-04 | CVE-2023-21624 | Unspecified vulnerability in Qualcomm products Information disclosure in DSP Services while loading dynamic module. | 5.5 |
| 2023-07-04 | CVE-2023-21629 | Double Free vulnerability in Qualcomm products Memory Corruption in Modem due to double free while parsing the PKCS15 sim files. | 6.8 |