Vulnerabilities > Qualcomm > Snapdragon 750G 5G Mobile Platform Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-11-04 | CVE-2024-33032 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption when the user application modifies the same shared memory asynchronously when kernel is accessing it. | 6.7 |
| 2024-11-04 | CVE-2024-38408 | Unspecified vulnerability in Qualcomm products Cryptographic issue when a controller receives an LMP start encryption command under unexpected conditions. | 9.1 |
| 2024-11-04 | CVE-2024-38415 | Use After Free vulnerability in Qualcomm products Memory corruption while handling session errors from firmware. | 7.8 |
| 2024-11-04 | CVE-2024-38422 | Unspecified vulnerability in Qualcomm products Memory corruption while processing voice packet with arbitrary data received from ADSP. | 7.8 |
| 2024-11-04 | CVE-2024-38423 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while processing GPU page table switch. | 7.8 |
| 2024-08-05 | CVE-2024-33014 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing ESP IE from beacon/probe response frame. | 7.5 |
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
| 2024-07-01 | CVE-2024-21462 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while loading the TA ELF file. | 5.5 |
| 2024-07-01 | CVE-2024-21465 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption while processing key blob passed by the user. | 7.8 |
| 2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |