Vulnerabilities > Qualcomm > Snapdragon 730 Mobile Platform Firmware

DATE CVE VULNERABILITY TITLE RISK
2024-01-02 CVE-2023-33110 Race Condition vulnerability in Qualcomm products
The session index variable in PCM host voice audio driver initialized before PCM open, accessed during event callback from ADSP and reset during PCM close may lead to race condition between event callback - PCM close and reset session index causing memory corruption.
local
high complexity
qualcomm CWE-362
7.0
2024-01-02 CVE-2023-33114 Use After Free vulnerability in Qualcomm products
Memory corruption while running NPU, when NETWORK_UNLOAD and (NETWORK_UNLOAD or NETWORK_EXECUTE_V2) commands are submitted at the same time.
local
low complexity
qualcomm CWE-416
7.8
2024-01-02 CVE-2023-43511 Infinite Loop vulnerability in Qualcomm products
Transient DOS while parsing IPv6 extension header when WLAN firmware receives an IPv6 packet that contains `IPPROTO_NONE` as the next header.
network
low complexity
qualcomm CWE-835
7.5
2023-12-05 CVE-2023-28546 Classic Buffer Overflow vulnerability in Qualcomm products
Memory Corruption in SPS Application while exporting public key in sorter TA.
local
low complexity
qualcomm CWE-120
7.8
2023-12-05 CVE-2023-28550 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in MPP performance while accessing DSM watermark using external memory address.
local
low complexity
qualcomm CWE-787
7.8
2023-12-05 CVE-2023-28551 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in UTILS when modem processes memory specific Diag commands having arbitrary address values as input arguments.
local
low complexity
qualcomm CWE-787
7.8
2023-12-05 CVE-2023-28585 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Memory corruption while loading an ELF segment in TEE Kernel.
local
low complexity
qualcomm CWE-119
8.8
2023-12-05 CVE-2023-28586 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.
local
low complexity
qualcomm CWE-119
6.5
2023-12-05 CVE-2023-28588 Integer Overflow or Wraparound vulnerability in Qualcomm products
Transient DOS in Bluetooth Host while rfc slot allocation.
network
low complexity
qualcomm CWE-190
7.5
2023-12-05 CVE-2023-33088 NULL Pointer Dereference vulnerability in Qualcomm products
Memory corruption when processing cmd parameters while parsing vdev.
local
low complexity
qualcomm CWE-476
7.8