Vulnerabilities > Qualcomm > Snapdragon 695 5G Mobile Platform Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2024-01-02 CVE-2023-43514 Use After Free vulnerability in Qualcomm products
Memory corruption while invoking IOCTLs calls from user space for internal mem MAP and internal mem UNMAP.
local
low complexity
qualcomm CWE-416
7.8
2023-12-05 CVE-2023-28546 Classic Buffer Overflow vulnerability in Qualcomm products
Memory Corruption in SPS Application while exporting public key in sorter TA.
local
low complexity
qualcomm CWE-120
7.8
2023-12-05 CVE-2023-28550 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in MPP performance while accessing DSM watermark using external memory address.
local
low complexity
qualcomm CWE-787
7.8
2023-12-05 CVE-2023-28551 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in UTILS when modem processes memory specific Diag commands having arbitrary address values as input arguments.
local
low complexity
qualcomm CWE-787
7.8
2023-12-05 CVE-2023-28585 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Memory corruption while loading an ELF segment in TEE Kernel.
local
low complexity
qualcomm CWE-119
8.8
2023-12-05 CVE-2023-28587 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level.
local
low complexity
qualcomm CWE-787
7.8
2023-12-05 CVE-2023-28588 Integer Overflow or Wraparound vulnerability in Qualcomm products
Transient DOS in Bluetooth Host while rfc slot allocation.
network
low complexity
qualcomm CWE-190
7.5
2023-12-05 CVE-2023-33088 NULL Pointer Dereference vulnerability in Qualcomm products
Memory corruption when processing cmd parameters while parsing vdev.
local
low complexity
qualcomm CWE-476
7.8
2023-12-05 CVE-2023-33092 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Memory corruption while processing pin reply in Bluetooth, when pin code received from APP layer is greater than expected size.
local
low complexity
qualcomm CWE-119
7.8
2023-12-05 CVE-2023-33098 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS while parsing WPA IES, when it is passed with length more than expected size.
network
low complexity
qualcomm CWE-125
7.5